Yield Engineer

Tel Aviv, IL

Job Description / Skills Required

Overview

Mellanox Technologies is looking for Product/Yield/Component Engineer.
The position will have responsibility to enhance Mellanox high speed optical Interconnect products performance, cost and quality by monitoring yields, performing data analysis and solving production issues.
Responsibilities

Maintaining high quality product deliveries to customer by data analysis and yield analysis, debug and failure analysis.
Perform Yield enhancement activities, characterization and test time reduction.
The candidate will work with process groups to improve or resolve process/product interactions
The candidate will work with design groups to improve or resolve design/product interactions
Qualification and Reliability activities execution and data analysis
Critical component management and material release for use in the final product
Interaction with vendors as part of product ramp up and during production
Management of quality issues at the CM
Active involvement with Marketing, and Applications Engineering for debug and customer problem solving

Qualifications

BSEE (MSEE pref.) or equivalent
Strong problem solving, multi-tasking and prioritization ability
Strong statistics and data analysis background (JMP, other tools)
Ability to drive projects to full execution in timely manner
Good understanding of product/test HW/Test software/Mechanical integration
Good software skills, especially in scripting languages
Strong presentation , communication skills
Fast learner
Self-Learner
Sense of urgency

Advantage:
Experience or background in running a product in high volume production (ICs, systems or other)
Technical project management skills – planning, organizing, multi-tasking, efficient problem solving, task force leadership and delivering to commitments.
Experience in IC/Silicon photonics manufacturing process including fab, test and assembly.
Familiar with high speed fiber optics products
ATE or system level testing experience
Good understanding of system/IC assembly process
Knowledgeable in DFT/DFM/DOE techniques