Avicena is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products. (www.avicena.tech)
About the role:
Responsibilities:
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Lead the architecture, design, and development of advanced semiconductor packaging solutions, including 2.5D/3D IC, System-in-Package (SiP), Flip Chip, and Wafer-Level Packaging.
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Define packaging requirements based on product performance, reliability, thermal, mechanical, and cost considerations.
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Collaborate with chip design, process engineering, and manufacturing teams to ensure seamless integration of packaging technologies with semiconductor designs.
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Drive packaging technology roadmaps, ensuring alignment with product development timelines and industry trends.
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Evaluate and implement new materials, processes, and equipment for next-generation packaging technologies.
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Provide technical leadership and mentorship to packaging engineers and cross-functional teams with the ability to create innovative packaging assembly flows within existing OSAT ecosystem
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Interface with customers and suppliers to ensure packaging solutions meet customer specifications and industry standards.
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Stay current on industry advancements and assess their applicability to company products / Knowledge of state-of-the-art in all relevant advanced packaging technologies
Qualifications:
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Education: MS/PhD in Materials Science, Electrical Engineering, Mechanical Engineering, or a related field.
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Experience: 10+ years of experience in semiconductor packaging design, development, and manufacturing. 5+ years of experience of working with major OSAT’s (ASE, AMKOR, SpiL etc). An extensive personal network within key OSATs would be very advantageous.
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Deep understanding of semiconductor device physics, packaging materials, and thermal/mechanical analysis.
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Proven experience with advanced packaging technologies, including 2.5D/3D packaging, SiP, Flip Chip, and WLP
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Good knowledge of specifications and requirements for hybrid bonding and heterogeneous integration.
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Experience with high-volume manufacturing and knowledge of process control and yield optimization.
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Strong leadership, problem-solving, and communication skills.
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Ability to work in a fast-paced environment and drive innovation.
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Any experience of Optical device manufacturing would be a distinct advantage
