Process Engineer – Plasma Etch

Sunnyvale, CA, US

Job Description / Skills Required

Avicena is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications.  This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products.  (www.avicena.tech)   

About the role:

  • Responsible for developing, optimizing, and maintaining plasma etching processes used in semiconductor manufacturing.
  • Design of Experiments for process performance, yield, and efficiency.
  • Responsible for fabrication of components partially between foundry services and in-house wafer fabrication resources.
  • Source and manage foundry services, contractors, and vendors.
  • Characterize processes and components using semiconductor metrology tools, profilometers, interferometers, SEM, electrical testers and optical testers.
  • Work with outside laboratories to characterize processes and devices, conduct failure analyses and model optoelectronic devices.
  • Regularly interface with other engineers in Process Engineering and Equipment Engineering.
  • Troubleshoot and resolve technical issues with photolithography equipment and processes.
  • Indirectly manage engineering technicians and operators.

Requirements:

  • BS in Chemical Engineering, Materials Science, Electrical Engineering or a related field.
  • 10+ years of related industrial experience and managing semiconductor or MEMS foundries.
  • Hands-on experience with plasma etch and micro-machining, including strong knowledge of ICP, RIE, DRIE, and wet etching of GaN and silicon.
  • Strong knowledge of other MEMS-relevant materials such as sacrificial and structural layers, wet/dry release layers, SU-8, and temporary wafer bonding processes.
  • Strong understanding of the effects of film stresses and the management of silicon integrity.
  • Strong familiarity with a clean room environment and other semiconductor processing equipment, including contact aligners, steppers, CVD, PVD, ALD, plasma ashing.
  • Proficient in Design of Experiments and Statistical Process Control methodologies.
  • Extremely organized, data-driven, and detail-oriented, with a strong desire to maintain thorough documentation and a baseline.
  • Ability to identify, troubleshoot, and communicate significantly complex engineering problems through documentation and regular presentations to senior and executive staff members.
  • Familiarity with health and safety regulations in a cleanroom environment.

Preferred Requirements:

  • MS or PhD in Engineering
  • 15+ years of related industrial experience
  • Strong knowledge of semiconductor device physics.
  • Proficient with JMP software.
  • Proficient with database queries using SQL
  • Computer modeling and simulation (optical, thermo-mechanical) desired, but not required.