Avicena is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products. (www.avicena.tech)
About the role:
Develop and maintain micro-lens array production and associated package assembly:
- Work with optical designers to generate optical micro-lens array specifications.
- Select and work closely with key suppliers to optimize micro-lens array design.
- Support assembly process and tooling development.
- Run flip-chip-like process and machines
- Support development of mechanical/optomechanical test procedures and systems at component and subsystem levels.
- Troubleshoot during product bring up and analyze data to optimize yield.
- Specify and oversee component reliability and qualification testing.
- Perform Failure Mode Engineering Analysis (FMEA) as needed.
Requirements:
- 5+ years experience in micro-component fabrication.
- Experience with wafer level assembly processing.
- Familiarity with optical fibers, optical launch optimization and optical loss testing.
- Cleanroom process experience
- Hands-on expertise with optical modelling software (Zemax, etc.)
- M.S. degree or higher in Mechanical Engineering, Opto-Mechanical Engineering, or equivalent.
- Ability to work independently in a fast-paced startup environment, adapt, and overcome unforeseen challenges.
- Excellent teamwork and interpersonal/communication skills within the company and with partners, customers, and consultants.